搜尋職缺
Senior High Voltage Analog Device Engineer_技術開發部(新竹廠)

06/02更新
Senior High Voltage Analog Device Engineer_技術開發部(新竹廠)
盧森堡商達爾國際股份有限公司台灣分公司
本職缺「優先面試持有經濟部能力鑑定證書者」
雇用型態
全職
工作型態
無遠端工作
分類
工具機機械設計工程師
分類
工具機機械設計工程師
薪資範圍
面議 經常性薪資達 4 萬元或以上
工作地點
新竹市
需求人數
1人
職缺描述
Overview:
The Senior Level High Voltage LNDMOS Device Engineer at Diodes, Inc. leads the design, development, and optimization of high‑voltage (30–100V+, up to 120V) LNDMOS devices using junction or deep trench isolation. The role bridges device physics and manufacturing to deliver reliable, efficient power devices for automotive, industrial, consumer, and renewable‑energy applications.
Key Responsibilities:
• Device Design and Development: Lead high‑voltage LNDMOS design focusing
on breakdown voltage, Rds(on), charge balance, and ruggedness. Use
CAD/TCAD for electrical, thermal, and reliability simulations to optimize devices
(30–120V, junction or trench‑isolated).
• Process Integration: Work with process teams to define/refine fabrication flows,
materials, doping, and steps to meet performance, manufacturability, and yield
targets.
• Device Characterization: Plan and execute electrical/thermal/reliability tests.
Characterize isolation structures (junction/trench), validate models, extract
parameters, and identify improvement opportunities.
• Technology Innovation: Research and propose new architectures or structures
(e.g., trench, superjunction, shielded gate) to enhance LNDMOS performance
and support next‑generation products.
• Failure Analysis and Problem Solving: Perform FA using SEM/TEM/FIB/EDX and
simulations to identify root causes and recommend corrective actions.
• Cross-functional Collaboration: Partner with design, process, test, packaging,
and product teams to ensure smooth development and product launch.
• Documentation and Reporting: Prepare technical documentation—design
specs, simulations, process flows, and characterization reports—and
communicate results to stakeholders.
• Product Qualification and Reliability: Support qualification through reliability
tests (HTRB, TDDB, ESD, UIS) and collaborate with quality teams to meet
international standards and customer needs.
• Yield Enhancement and Cost Optimization: Analyze manufacturing data to
identify yield/cost issues and work with fab teams on implement solutions.
• Technical Support: Provide expertise to application engineers, field teams, and
customers for device integration, troubleshooting, and performance
optimization.
Qualifications:
• Minimum 10 years of experience in power semiconductor device engineering,
focused on high‑voltage LNDMOS/LDMOS (30–120V). Strong understanding of
deep trench and junction isolation; experience with IGBT or SiC/GaN MOSFETs is
a plus.
• Proficient with device/process simulation tools (e.g., Sentaurus, Atlas).
• Solid understanding of semiconductor physics, HV breakdown, isolation
structures, and reliability mechanisms.
• Hands‑on experience in wafer fabrication, cleanroom operations, and device
characterization.
• Familiar with advanced failure analysis tools and methods.
• Knowledge of device reliability and ruggedness standards.
• Skilled in statistical analysis and data‑driven problem solving.
• Strong analytical skills and attention to detail.
• Excellent technical communication and documentation abilities.
• Able to work independently and collaboratively across teams.
• Innovative, proactive problem‑solver.
• Results‑oriented with strong quality and continuous‑improvement mindset.
The Senior Level High Voltage LNDMOS Device Engineer at Diodes, Inc. leads the design, development, and optimization of high‑voltage (30–100V+, up to 120V) LNDMOS devices using junction or deep trench isolation. The role bridges device physics and manufacturing to deliver reliable, efficient power devices for automotive, industrial, consumer, and renewable‑energy applications.
Key Responsibilities:
• Device Design and Development: Lead high‑voltage LNDMOS design focusing
on breakdown voltage, Rds(on), charge balance, and ruggedness. Use
CAD/TCAD for electrical, thermal, and reliability simulations to optimize devices
(30–120V, junction or trench‑isolated).
• Process Integration: Work with process teams to define/refine fabrication flows,
materials, doping, and steps to meet performance, manufacturability, and yield
targets.
• Device Characterization: Plan and execute electrical/thermal/reliability tests.
Characterize isolation structures (junction/trench), validate models, extract
parameters, and identify improvement opportunities.
• Technology Innovation: Research and propose new architectures or structures
(e.g., trench, superjunction, shielded gate) to enhance LNDMOS performance
and support next‑generation products.
• Failure Analysis and Problem Solving: Perform FA using SEM/TEM/FIB/EDX and
simulations to identify root causes and recommend corrective actions.
• Cross-functional Collaboration: Partner with design, process, test, packaging,
and product teams to ensure smooth development and product launch.
• Documentation and Reporting: Prepare technical documentation—design
specs, simulations, process flows, and characterization reports—and
communicate results to stakeholders.
• Product Qualification and Reliability: Support qualification through reliability
tests (HTRB, TDDB, ESD, UIS) and collaborate with quality teams to meet
international standards and customer needs.
• Yield Enhancement and Cost Optimization: Analyze manufacturing data to
identify yield/cost issues and work with fab teams on implement solutions.
• Technical Support: Provide expertise to application engineers, field teams, and
customers for device integration, troubleshooting, and performance
optimization.
Qualifications:
• Minimum 10 years of experience in power semiconductor device engineering,
focused on high‑voltage LNDMOS/LDMOS (30–120V). Strong understanding of
deep trench and junction isolation; experience with IGBT or SiC/GaN MOSFETs is
a plus.
• Proficient with device/process simulation tools (e.g., Sentaurus, Atlas).
• Solid understanding of semiconductor physics, HV breakdown, isolation
structures, and reliability mechanisms.
• Hands‑on experience in wafer fabrication, cleanroom operations, and device
characterization.
• Familiar with advanced failure analysis tools and methods.
• Knowledge of device reliability and ruggedness standards.
• Skilled in statistical analysis and data‑driven problem solving.
• Strong analytical skills and attention to detail.
• Excellent technical communication and documentation abilities.
• Able to work independently and collaboratively across teams.
• Innovative, proactive problem‑solver.
• Results‑oriented with strong quality and continuous‑improvement mindset.
職務需求
工作經驗:10年以上
學歷限制:碩士
學歷限制:碩士
職位福利
休假制度:週休二日
企業資訊
企業名稱
盧森堡商達爾國際股份有限公司台灣分公司
公司地址
新北市新店區民權路50號7F
認同的鑑定項目
資訊安全工程師能力鑑定、電動車機電整合工程師能力鑑定、電磁相容工程師能力鑑定、電路板製程工程師能力鑑定
企業介紹
Diodes 公司 (Nasdaq:DIOD) 是標準普爾小型股 600 指數和羅素 3000 指數成員公司,為高品質應用特定標準產品全球製造商與供應商,產品涵蓋廣泛領域,包括分離、邏輯、類比及混合訊號半導體市場。Diodes 亦為汽車、工業、運算、消費性電子及通訊等市場提供服務。
Diodes 的產品包括二極體、整流器、電晶體、MOSFET、GPP橋、GPP整流器、保護裝置、特定功能陣列、單閘極邏輯、放大器與比較器、霍爾效應與溫度感測器、電源管理設備,包括AC-DC 轉換器與控制器、DC-DC 開關與線性穩壓器,以及電壓參考與LED驅動器;以及特殊功能裝置,例如 USB 電源開關、負載開關、電壓監控器及馬達控制器。Diodes 亦提供高速信號的定時、連接、開關與信號完整性解決方案。
Diodes 公司總部及美洲銷售辦公室位於美國德州普拉諾 (Plano) 與加州米爾皮塔斯 (Milpitas)。設計、行銷與工程中心位於普拉諾、米爾皮塔斯、臺北、桃園、新竹、上海、揚州、英國奧爾德姆及德國紐豪斯 。Diodes 的晶圓生產設施位於美國緬因州南波特蘭;英國格林諾克奧爾德姆;中國上海和無錫;還有基隆和新竹。Diodes 在中國上海、濟南、成都、無錫、中壢和基隆以及德國紐豪斯設有組裝與測試設施。另外在多個據點設有工程、銷售、倉儲及物流辦公室,包括臺北、香港、上海、深圳、武漢、揚州;英國奧爾德姆;南韓城南市以及德國慕尼克、法蘭克福,並於世界各地設有支持辦公室。
公司生產設施已通過國際公認標準ISO-9001:2015、ISO 14001:2015和IATF16949:2016的品質認證。
Diodes 公司目前擁有 C-TPAT 認證。
上述品質獎反映 Diodes 公司優異的品管技術,並進一步提升我們在重視品質與一致性的 OEM 業者心目中極佳廠商的地位。